Tuesday, November 4, 2014

Tough electronics based on bullet-proof kevlar

A group of researchers is exploring novel ways to apply semiconductor industry processes to unique substrates to "weave together" multifunctional materials with distinct capabilities. They describe how they were able to "weave" high-strength, highly conductive yarns made of tungsten on Kevlar -- aka body armor material -- by using atomic layer deposition, a process commonly used for producing memory and logic devices.

from Geochemistry News -- ScienceDaily http://ift.tt/1scvbUj


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